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4650 results for found: utilisé Bonders

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  • THROUGH MILTON FENG :

    CASCADE MICROTECH / ALESSI 12000 Semiautomatic prober, 8" Configuration: Microchamber capability (1) MITUTOYO M Plan APO 10x / 0.28 objective lens (1) MITUTOYO M Plan APO 2x / 0.055 objective lens (2) MITUTOYO 10x / 24 eye pieces PANASONIC GP-KR222 color closed-circuit camera KINETIC SYSTEMS isolation bench Vibraplane 9101-02-22 optical table, 42 x 36 x 1" TEMPTRONIC TP031SB-TS-1 fluid heater, power supply and flow control PC with control software CASCADE MICROTECH card holder Holds card sizes 11.4 x 0.5 to 0.32 x 28.9 cm 2002 vintage.
  • ADT / K&S: 4123

    ADT / K&S 4123 Wedge bonder.
  • ADT / K&S: 4523

    ADT / K&S 4523 Wire bonder Heated work holder (2) OLYMPUS GSWH 10x/22 lenses (2) OLYMPUS GSWH 20x/12.5 lenses SCHOTT FOSTEC 20500 fiber optic illuminator with ring light 2001 vintage.
  • ADT / K&S: 1474FP

    K&S 1474FP Automatic wedge bonder 7 wire bond head Flat board loader / unloader Software version: 8-60-2-24G USG data sheet MDP file diskette Spare power supply.
  • ADT / K&S: 8090

    K&S 8090 Aluminum wedge wire bonder.
  • ADT / K&S: 4523

    K&S 4523 Wire bonder Heated holder (2) OLYMPUS GSWH 10x/22 lenses (2) OLYMPUS GSWH 20x/12.5 lenses SCHOTT FOSTEC 20500 fiber optic illuminator with ring light 2001 vintage.
  • ALPHASEM: E 8003

    ALPHASEM E 8003 clip bonder 164-228V / 328-456V, 3Ph, 5 wires, 50/60Hz, 12.5A Approx. weight: 1500Kg 2000 vintage.
  • AMICRA: AFC PLUS

    AMICRA AFC Plus Flip chip bonders 75 W laser with simple shaping line lens Flipping unit: Rotation stage (180° movement), Z-stage Shielding gas unit: heated gas jet stream Heater control unit (4) Bond tools with heater (4) Bond tool holders.
  • AMICRA MICROTECHNOLOGIES: NOVA PLUS

    AMICRA MICROTECHNOLOGIES Nova Plus Dual head die bonder system 2011 vintage.
  • AMICRA MICROTECHNOLOGIES: NOVA PLUS

    AMICRA MICROTECHNOLOGIES Nova Plus Dual head die bonder system 2011 vintage.
  • AMICRA MICROTECHNOLOGIES: NOVA PLUS

    AMICRA MICROTECHNOLOGIES Nova Plus Dual head die bonder system 2011 vintage.
  • ANORAD: FCB 5300

    ANORAD: FCB 5300 modified die bonder with ANORAD pression placement linear slides, quick draw conveyor, barcode reader, flat screen monitor, industral computer. Includes 1 Oneac power line conditioner.
  • APPLIED MATERIALS: P 5000 MARK II

    APPLIED MATERIALS P 5000 Mark II Plasma etcher Previously used as a P 5000 W CVD system Previous processes run: Oxide, poly Gas configuration: CHF3 - HE/O2 - He- SF6 - CL2 - HBR - O2 - CF4 Includes: Main frame (2) Mark II etch chambers ALCALTEL 2033 and 2063 pumps Software version: 4.2.6 Load lock 1994 vintage.
  • ASM: EAGLE 60

    (qty 5) ASM Eagle 60 Automatic wire bonders Can be converted to copper wire Bonding system: Bonding method: thermosonic (TS) BQM mode: constant current, voltage, power and normal (programmable) Loop type: normal, low, square, penta, J, VLED, FLEX XY resolution: 0.2 um Z resolution (capillary traveling motion): 0.4 um Fine pitch capability: 35 um pitch at 0.6 mil wire Number of bonding wires: up to 3000 Program storage: 1000 programs on hard disk Multimode transducer system: programmable profile, control and vibration modes Vision system: Pattern recognition time: 60 ms / point Pattern recognition accuracy: ± 0.37 µm Lead locator detection: 12 ms / lead (3 leads / frame) Lead locator accuracy: ± 2.4 µm Post bond inspection: first bond, second bond, and wire tracing Maximum die level different: 400 to 500 µm Material handling system: Indexing speed: 200 to 250 ms at 0.5" pitch Indexer resolution: 1 µm Lead frame positioning accuracy: ± 2 mil Applicable lead frame: W: 24 to 73 mm at bonding area in Y = 65 mm W: 24 to 90 mm at bonding area in Y = 48 mm L: 280 mm (maximum) T: 0.075 to 0.8 mm Applicable magazine: W: 98 mm (maximum L: 140 to 280 mm H: 180 mm (maximum) Magazine pitch: 2.4 to 10 mm (0.09" to 0.39") Device changeover: Less than 4 minutes Package changeover: Less than 5 minutes Number of buffer magazines: 3, maximum 435 mm Facilities: Voltage: 110VAC (100/120/200/210/220/230/240 VAC) Voltage tolerance: +/- 10% Frequency: 50 Hz (60 Hz optional) Frequency tolerance: +/- 1% Phase: single Compressed air: 360 LPM maximum at 3 to 6 bar Power consumption: 1500W Operating condition: Ambient temperature: 5°C to 40°C Humidity: <80% Altitude: up to 1000m above sea level 2004 vintage.
  • ASM: EAGLE 60

    ASM Eagle 60 Automatic wire bonders Can be converted to copper wire Bonding system: Bonding method: thermosonic (TS) BQM mode: constant current, voltage, power and normal (programmable) Loop type: normal, low, square, penta, J, VLED, FLEX XY resolution: 0.2 um Z resolution (capillary traveling motion): 0.4 um Fine pitch capability: 35 um pitch at 0.6 mil wire Number of bonding wires: up to 3000 Program storage: 1000 programs on hard disk Multimode transducer system: programmable profile, control and vibration modes Vision system: Pattern recognition time: 60 ms / point Pattern recognition accuracy: ± 0.37 µm Lead locator detection: 12 ms / lead (3 leads / frame) Lead locator accuracy: ± 2.4 µm Post bond inspection: first bond, second bond, and wire tracing Maximum die level different: 400 to 500 µm Material handling system: Indexing speed: 200 to 250 ms at 0.5" pitch Indexer resolution: 1 µm Lead frame positioning accuracy: ± 2 mil Applicable lead frame: W: 24 to 73 mm at bonding area in Y = 65 mm W: 24 to 90 mm at bonding area in Y = 48 mm L: 280 mm (maximum) T: 0.075 to 0.8 mm Applicable magazine: W: 98 mm (maximum L: 140 to 280 mm H: 180 mm (maximum) Magazine pitch: 2.4 to 10 mm (0.09" to 0.39") Device changeover: Less than 4 minutes Package changeover: Less than 5 minutes Number of buffer magazines: 3, maximum 435 mm Facilities: Voltage: 110VAC (100/120/200/210/220/230/240 VAC) Voltage tolerance: +/- 10% Frequency: 50 Hz (60 Hz optional) Frequency tolerance: +/- 1% Phase: single Compressed air: 360 LPM maximum at 3 to 6 bar Power consumption: 1500W Operating condition: Ambient temperature: 5°C to 40°C Humidity: <80% Altitude: up to 1000m above sea level 2004 vintage.
  • ASM: EAGLE 60

    ASM: Eagle 60 Wire bonder Bonding method: Thermosonic Wire size: 15um to 50.8um Au copper wire Wire length: Max 8mm Bonding speed: 60+ms for 2mm wire (Q loop) Bond placement accuracy: +/- 3.0um @ 3 sigma Bonding area: 54mm x 65mm (LF width < 72mm) Pattern recognition time: 60 ms/ point Pattern recognition: +/- 0.37um Accuracy Lead locator detection: 12ms/lead (3 leads/frame) Loop control: Programmable and auto loop XY Resolution: 0.2um Z Resolution: 0.4um No. of bonding wires: up to 1000 Program storage: 1000 programs on hard disk Transducer system: 138 kHz User interface: PC Menu interface Bi-lingual man machine interface Host communication via SECS I & II protocol Material handling system: Applicable magazine: L: 140-295mm H: Max 180mm W: 16-100mm Applicable leadframe: L: 140-295mm T: 0.1-0.8mm W: 23-90mm Magazine pitch: 2.4-10mm programmable Device changeover: <5 minutes between L/F types < 4 minutes within the same L/F No of Buffer magazines: 3 Facilities: Voltage: 110 Vac, 50/60 Hz Compressed air: 150 LPM max at 3 bar Power consumption: Max 1500W 2005 vintage.
  • ASM: 530

    ASM AB 530 Wedge bonder.
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