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4995 results for found: utilisé Wafer Grinding, Lapping & Polishing

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  • ABWOOD: SG4H/HS

    ABWOOD SG4H/HS Vertical spindle hydraulic surface grinder 5 HP, coolant Capacity: 8" x 20" Maximum Work Height: 10-1/2" Grinding Wheel Diameter: 8" Motor: 5.5 HP Equipped With: Fine Line Chuck With ControllerCoolant System 1981 vintage.
  • ABWOOD: TS5

    ABWOOD TS5 Double backstop fine grinders 2011 vintage.
  • ACCRETECH: MEP-5800

    ACCRETECH MEP-5800 Grinder 2007 vintage. AMI / PRESCO MSP 1505 Screen printer with Avisis II vision, 110 V.
  • ACCRETECH / TOKYO SEIMITSU: W-GM-3000

    ACCRETECH / TOKYO SEIMITSU W-GM-3000 Edge grinder Power: 220 VAC - 4.5 KVA 1998 vintage.
  • ACCRETECH / TSK: PG 200 RM

    ACCRETECH / TSK PG 200 RM Polisher/Grinder, 8" 200 VAC, 3 Ph, 50-60Hz, 25kVa Kg/cm2 : psi: 0.0352 to 0.0492 0.5 to 0.7 Liters/min : gpm: 200L / min Vacuum (kg/cm2 : psi) liters/min : gpm: 0.0141 to 0.0211 0.2 to 0.3 DI Water (kg/cm2 : psi): 0.0141 to 0.0352 0.2 to 0.5 Temp: 20 to 25 deg Celsius.
  • ACCRETECH / TSK: PG 200 RM

    ACCRETECH / TSK PG 200 RM Grinder, 8", 2004 vintage.
  • ACCRETECH / TSK: PG 200 RM

    ACCRETECH / TSK PG 200 RM Grinders, 4"-8" 2001-2005 vintage.
  • ACCRETECH / TSK: 3808

    ACCRETECH / TSK 3808 Gigamat polisher, open, (4) heads Flat panel touch screen controls 1168mm diameter x 25.4mm thick platen size 0-70rpm Bi-directional head rotation 3-HP head drive motor per head Adjustable head pressure per head 0-70rpm bi-directional platen rotation 25 HP platen drive assembly 3" - 8" wafer diameter capacity 14-3 wafers per carrier respectively Platens appear to be aluminum Tool Polished Quartz/Lithium Tantalate/Lithium Niobate Down force pressure can be applied up to 14 lbs per sq. inch. Aluminum carriers included - 4 heads Current condition of the carriers (flatness) - heads are +/- .0004 Chemicals used: KOH (pH ~ 8-9) / Cerium Oxide/ Cosil Silica Tools and process area: Most metals are stainless steel or aluminium No carriers PC with DOS operation system Polishing pressure used on tool: 5-10 PSI Down Force(14 PSI Max) 480 VAC- 60 Hz-3P DI Water Vacuum 20-30 In H2O Compressed air 60-80 PSI Chiller Water Maximum head pressure is 70 PSIG (100%) - Based on TSK Calibrate Head Pressure Run time: ~75K hours 480V, 3 phase 1998-2000 vintage.
  • ACCRETECH / TSK: PG 200

    ACCRETECH / TSK PG 200 Back Grinder.
  • ACCRETECH / TSK: WGM 2000

    ACCRETECH / TSK WGM 2000 Edge grinders, 6".
  • ACCRETECH / TSK: WGM 2000

    ACCRETECH / TSK WGM 2000 Edge grinders, 6".
  • ACCRETECH / TSK: PG 300 RM

    ACCRETECH / TSK PG 300 RM Back grinder / polisher 8" and 12" wafer conversion kit (4) Chucks mounted to an indexing table system with auto cleaning unit Rough grind station with thickness monitor Fine grind station with thickness monitor Integrated polish station complete with conditioning unit Graphical User Interface (GUI) LCD touch panel RM300 wafer to frame laminating system, alignment system, front-side wafer de-taping system SEMI S2-93 Certified Bypassable door interlock for PG and RM Pad thickness parameter to allow up to 6mm pad 2-channel temperature control unit for cooling spindle and heating polish head In-line UV System DAF Tape laminator option for pre-cut tape (DAF/Dicing tape) Auto lot split capability 2005 vintage.
  • ACCRETECH / TSK: PG 200 RM

    ACCRETECH / TSK PG 200 RM Back grinder.
  • ACCRETECH / TSK: W-GM 3000

    ACCRETECH / TSK W-GM 3000 Edge grinder Power: 220 VAC, 4.5 KVA 1998 vintage.
  • ACCRETECH / TSK: PG 300 RM

    ACCRETECH / TSK PG 300 RM Back grinder / polisher 8" and 12" wafer conversion kit (4) Chucks mounted to an indexing table system with auto cleaning unit Rough grind station with thickness monitor Fine grind station with thickness monitor Integrated polish station complete with conditioning unit Graphical User Interface (GUI) LCD touch panel RM300 wafer to frame laminating system, alignment system, front-side wafer de-taping system SEMI S2-93 Certified Bypassable door interlock for PG and RM Pad thickness parameter to allow up to 6mm pad 2-channel temperature control unit for cooling spindle and heating polish head In-line UV System DAF Tape laminator option for pre-cut tape (DAF/Dicing tape) Auto lot split capability.
  • ACCRETECH / TSK: PG 200 RM

    ACCRETECH / TSK PG 200 RM Back grinder, 8" Full Auto in-line back grind and wafer mounter-peeler Missing robot H1 robot Hand 8", PM03171-0931 2006 vintage.
  • ACCRETECH / TSK: PG 200 RM

    ACCRETECH / TSK PG 200 RM Grinder, 8", 2004 vintage.
  • ACCRETECH / TSK: PG 300 RM

    ACCRETECH / TSK PG 300 RM Back Grinder / Polisher.
  • ACCRETECH / TSK: 3808

    ACCRETECH / TSK 3808 Gigamat polisher, open, (4) heads Flat panel touch screen controls 1168mm diameter x 25.4mm thick platen size 0-70rpm Bi-directional head rotation 3-HP head drive motor per head Adjustable head pressure per head 0-70rpm bi-directional platen rotation 25 HP platen drive assembly 3" - 8" wafer diameter capacity 14-3 wafers per carrier respectively Platens appear to be aluminum Tool Polished Quartz/Lithium Tantalate/Lithium Niobate Down force pressure can be applied up to 14 lbs per sq. inch. Aluminum carriers included - 4 heads Current condition of the carriers (flatness) - heads are +/- .0004 Chemicals used: KOH (pH ~ 8-9) / Cerium Oxide/ Cosil Silica Tools and process area: Most metals are stainless steel or aluminium No carriers PC with DOS operation system Polishing pressure used on tool: 5-10 PSI Down Force(14 PSI Max) 480 VAC- 60 Hz-3P DI Water Vacuum 20-30 In H2O Compressed air 60-80 PSI Chiller Water Maximum head pressure is 70 PSIG (100%) - Based on TSK Calibrate Head Pressure Run time: ~75K hours 480V, 3 phase Currently installed Can be demonstrated 1998-2000 vintage.
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