Occasion ASM AD 838L-G2 #293758337 à vendre en France

Die bonders, 8" XY Position accuracy: ± 0.4 mil (10 μm) @ 30σ Closeup view camera: ± 1.0 mil (25 μm) @ 30σ Wafer rotation: 40mil x 40 mil wafer: ±1 @ 30σ <40mil x 40 mil wafer: Close top-view camera: ±3 @ 30σ Closeup via camera: 0.15 x 0.15 mm-2.03 x 2.03 mm 0.15 x 0.15 mm-10.16 x 10.16 mm Substrate size: Length: 2.36"-11.81" (60-300 mm) Width: 2.36"-3.94" (60-100 mm) Thickness: 5-118 mil (0.12-3.00 mm) Box size: Length: 2.36"-12.20" (60-310 mm) Width: 2.36"-4.33" (60-110 mm) Height: 2.68"-7.48" (68-190 mm) Wafer handling system: Feed type: Clamping water expander Water size: Up to 8" (200 mm) Clamp, 6" Maximum load current: 11.5 A @ 220 V-1,500 W Compressed air flow: 88 LPM + 247 LPM @ 6 bar Power supply: 100-240 VAC, 50/60 Hz, 220 V-1500 W, Single phase.