Occasion PLASMATHERM 790 Series #293724143 à vendre en France

Reactive Ion Etcher (RIE), 8" Turbo pump: 10^-5 Torr Right chamber: CHF3 (54 SCCM) O2 (20 SCCM) H2 (20 SCCM) Ar (50 SCCM) Left chamber: Cl2 (20 SCCM) HBr (100 SCCM) O2 (20 SCCM) CF4 (50 SCCM) He (100 SCCM) Recipes: SiO2: CHF3: 40 SCCM O2: 3 SCCM DC: 400V (RF: 182W) Power: 40 mTorr / Etch rate: 32 nm/min Poly silicon: HBr: 20 SCCM Cl2: 5.5 SCCM DC Bias: 70 mTorr Silicon: HBr: 25 SCCM Cl2: 4 SCCM DC: 250V (RF: 128W) Pressure:40 mTorr Etch rate: 37 nm/min Silicon: Cl2: 25 SCCM O2: 3.1 SCCM RF Power: 200 W, 30 mTorr Residual resist layer (SFIL Process): O2: 8 SCCM DC: 200V Power: 5 mTorr Etch rate: 46 nm/min Barc-DUV30J: CHF3: 15 SCCM O2: 7.5 SCCM DC: 200V Power: 25 mTorr Etch rate: 60 nm/min.