Occasion ELECTROGLAS / EG 4090u #9210101 à vendre en France

Probers, 4"-8" Cassette: 25 or 26 Slots Sequential Programmable access controllable via external I/O Auxiliary wafer tray Quick single wafer insertion and extraction Cross slot wafer detection Intelligent quick load pipelining Closed loop material handling Accuracy: ±4 μm (System accuracy includes X, Y, ø / Z) XY Positioning: Travel: 19.80” (503 mm) X, 9.42” (239 mm) Y Maximum speed: 10.0 in/sec (254.0 mm/sec) Resolution: 0.01 mils (0.25 μm) Repeatability: 0.01 mils (0.25 μm) Maximum acceleration: Standard configuration: 1.1G X axis, 0.53G Y axis High force configuration: 0.88G X axis, 0.42G Y axis Z-Stage: Resolution Z: 0.25 mil 0.125 mil Load: Std. Z-stage: 25 lbs (11.3 kgs) 40 lbs (18.0 kgs) HFZ-2: 135 lbs (61 kgs) 154 lbs (70 kgs) Speed: 390 μsec/step 390 μsec/step Probing range: 200 mil (5.1 mm) 200 mil (5.1 mm) Travel full: 400 mil (10.2 mm) 400 mil (10.2 mm) Repeatability Z: 0.25 mil (6.4 μm) 0.125 mil (3.2 μm) ø Travel: ±5° ±5° ø Resolution: 0.000917°/step 0.000917°/step Chuck tops: Standard: Ambient probing Hot: Ambient to 130°C Specials: Other ranges (Hot and cold) Low compliance chuck tops: With HFZ-2 only Standard: Ambient probing Hot: Ambient to 130°C Available in Au, Ni, Al (Unplated) Tester communications: Tester interfaces / Protocols supported RS232C TTL (Parallel I/0) GPIB (IEEE-488) EG Enhanced RDP Automation: PTPA: Probe to pad alignment Aluminized wafer DPS II: Direct probe sensor II APPV: Automatic probe position verification PTPO: Probe to pad optimization OCR: Optical character recognition PMI: Probe mark inspection IDI: Ink dot inspection STAA: Self teach auto align WSSC: Wafer stepping and scaling calibration APCC: Automatic probe cleaning and continuity pad CPCS II: Chuck probe contact sensor II BSBC: Back side bar code reader System architecture: Multiple processors base around Pentium core Flash memory (Core program) PCI Bus internal PCBs (Serial and video) PCI Bus ethernet PCB providing 10 and 100 MHz I/O speeds Interface capabilities: Tester interface packages Motorized probe card theta Semi automatic probe card GEM: Generic equipment model SEMI Standard communications for factory automation and control AUI: Advanced user interface FPD: Flat panel display, 10.4” Active matrix display Touch screen Elastomer keyboard Clean room compatible AT Style Tester communications: Tester interfaces and protocols supported RS232C, TTL (Parallel I/0), GPIB (IEEE-488) EGEnhanced, RDP Prober mini-environment (Class 1): Up to class: 10,000 areas Electrical: Volts Amps Hz 100 16.5 50/60 115 15.0 50/60 230 7.5 50/60 Footprint: Standard: 45.3” (115 cm) W x 35.2” (89.4 cm) D x 34.2” (88 cm) H Mini-e/SMIF: 52.5” (133.4 cm) W x 35.2” (89.4 cm) D x 34.2 (88 cm) H Air: Minimum 85 psi CDA, 1.0 SCFM Vacuum: Minimum 22 in Hg, 1.25 SCFM (Momentary flow for 15 sec).